IP Library Granted Patent US 815,959
Granted Patent S1
US 815,959 · App. 29/571,482 · Granted Apr 24, 2018

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Quick Facts
Patent No.
US 815,959
App. No.
29/571,482
Granted
Apr 24, 2018
Kind
S1
Claims (1)

The ornamental design for a package, as shown and described.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2021
From: TORCHIN, EVAN; BORING, BRIAN; CHRISTMAN, HELENE; PUGH, PAUL; BOAM, ERIC; FRIES, BREYNA
To: UNDER ARMOUR, INC.
Reel/Frame 055511/0986 →
SECURITY INTEREST Recorded May 13, 2020
From: UNDER ARMOUR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052654/0756 →