IP Library › Granted Patent US 807,176
Granted Patent S1
US 807,176 · App. 29/573,755 · Granted Jan 9, 2018

Blister package with surface ornamentation

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Quick Facts
Patent No.
US 807,176
App. No.
29/573,755
Granted
Jan 9, 2018
Kind
S1
Claims (1)

The ornamental design for a blister package with surface ornamentation, as shown and described.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2017
From: GARAY, ANTHONY
To: MERTZ DESIGN, INC.
Reel/Frame 043598/0140 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2017
From: MERTZ DESIGN, INC.
To: THE GILLETTE COMPANY LLC
Reel/Frame 043598/0149 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2017
From: BOULDING, ADAM; HIELSCHER, CHRISTINE; HÜBNER, MARLIS; RENO, BETH
To: THE GILLETTE COMPANY LLC
Reel/Frame 043598/0184 →
MERGER AND CHANGE OF NAME Recorded Sep 26, 2016
From: THE GILLETTE COMPANY; THE GILLETTE COMPANY LLC
To: THE GILLETTE COMPANY LLC
Reel/Frame 040145/0258 →