IP Library › Granted Patent US 810,904
Granted Patent S1
US 810,904 · App. 29/583,384 · Granted Feb 20, 2018

Flapper for the roof of a power conditioning subsytem

Inventors: Kenichiro Omote (Tokyo, JP); Kenji Oda (Tokyo, JP)
Assignee: Toshiba Mitsubishi-Electric Industrial Systems Corporation
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Quick Facts
Patent No.
US 810,904
App. No.
29/583,384
Granted
Feb 20, 2018
Kind
S1
Claims (1)

The ornamental design for a flapper for the roof of a power conditioning subsystem, as shown and described.

Assignments (3)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 040227 FRAME: 0461. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 20, 2016
From: OMOTE, KENICHIRO; ODA, KENJI
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 041038/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2016
From: OMOTE, KENICHIRO; ODA, KENJI
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS
Reel/Frame 040227/0461 →
Priority Claims (1)
JP 2016-011387 · May 30, 2016 · national