IP Library Granted Patent US 852,617
Granted Patent S1
US 852,617 · App. 29/622,562 · Granted Jul 2, 2019

Packaging receptacle

Inventors: James J. Sanfilippo (Barrington Hills, IL); John E. Sanfilippo (Barrington Hills, IL)
Assignee: Sonoco Development Inc.
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Quick Facts
Patent No.
US 852,617
App. No.
29/622,562
Granted
Jul 2, 2019
Kind
S1
Claims (1)

The ornamental design for a packaging receptacle, as shown and described.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2025
From: SONOCO DEVELOPMENT, INC.
To: TOPPAN THERMOFORMED PACKAGING HOLDINGS, INC.
Reel/Frame 071282/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2018
From: SANFILIPPO, JAMES J.; SANFILIPPO, JOHN E.
To: SONOCO DEVELOPMENT INC.
Reel/Frame 044750/0840 →