IP Library › Granted Patent US 914,624
Granted Patent S1
US 914,624 · App. 29/687,682 · Granted Mar 30, 2021

Electronic device housing

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 914,624
App. No.
29/687,682
Granted
Mar 30, 2021
Kind
S1
Claims (1)

The ornamental design for a electronic device housing, as shown and described.

Assignments (4)
MERGER Recorded Nov 13, 2023
From: HITACHI ENERGY SWITZERLAND AG
To: HITACHI ENERGY LTD
Reel/Frame 065548/0905 →
CHANGE OF NAME Recorded Dec 31, 2021
From: ABB POWER GRIDS SWITZERLAND AG
To: HITACHI ENERGY SWITZERLAND AG
Reel/Frame 058666/0540 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2021
From: ABB SCHWEIZ AG
To: ABB POWER GRIDS SWITZERLAND AG
Reel/Frame 055585/0534 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2019
From: ALFREDSSON, FREDRIK; EDOFF, MIKAEL
To: ABB SCHWEIZ AG
Reel/Frame 050593/0511 →