IP Library › Granted Patent US 994,739
Granted Patent S1
US 994,739 · App. 29/792,126 · Granted Aug 8, 2023

Heat press pad

Inventors: Yung Tseng Chen (San Francisco, CA); Thomas Crisp (Cottonwood Heights, UT); Francois Laine (Walnut Creek, CA); H. William Smith (South Jordan, UT); Kenneth Sweet (South Jordan, UT)
Assignee: Cricut, Inc.
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Quick Facts
Patent No.
US 994,739
App. No.
29/792,126
Granted
Aug 8, 2023
Kind
S1
Claims (1)

The ornamental design for a heat press pad, as shown and described.

Assignments (1)
SECURITY INTEREST Recorded Aug 8, 2022
From: CRICUT, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 061102/0118 →