Granted Patent
S1
US 996,593 · App. 29/797,499 · Granted Aug 22, 2023
Cooling device
Assignee:
TECMEN ELECTRONICS CO., LTD
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Claims (1)
The ornamental design for a cooling device, as shown and described.
Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Apr 17, 2023
From: TECMEN ELECTRONICS CO., LTD.
To: TECMEN ELECTRONICS CO., LTD
Reel/Frame 063353/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Jun 30, 2021
From: WU, ZIQIAN
To: TECMEN ELECTRONICS CO., LTD.
Reel/Frame 056729/0468 →
Priority Claims (1)
CN 202130146060.5
· Mar 18, 2021
· national