IP Library › Granted Patent US 997,219
Granted Patent S1
US 997,219 · App. 29/811,485 · Granted Aug 29, 2023

Polycrystalline diamond compact with a double-layer structure

Inventors: Haijiang Fang (Zhengzhou, CN); Weifeng Du (Zhengzhou, CN); Yongfeng Wang (Zhengzhou, CN); Jian Yang (Zhengzhou, CN)
Assignee: SF DIAMOND CO., LTD.
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Quick Facts
Patent No.
US 997,219
App. No.
29/811,485
Granted
Aug 29, 2023
Kind
S1
Claims (1)

The ornamental design for a polycrystalline diamond compact with a double layer structure, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 23, 2021
From: FANG, HAIJIANG; DU, WEIFENG; WANG, YONGFENG; YANG, JIAN
To: SF DIAMOND CO., LTD.
Reel/Frame 058197/0285 →