IP Library › Granted Patent US 1,039,909
Granted Patent S1
US 1,039,909 · App. 29/827,257 · Granted Aug 27, 2024

Connector of packaging for foodstuffs

Inventors: Wu-Chou Kuo (Taipei, TW); Yu-Min Lee (New Taipei, TW)
Assignee: Botrista, Inc.
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Quick Facts
Patent No.
US 1,039,909
App. No.
29/827,257
Granted
Aug 27, 2024
Kind
S1
Claims (1)

The ornamental design for a connector of packaging for foodstuffs, as shown and described.

Assignments (3)
SECURITY INTEREST Recorded Feb 13, 2025
From: BOTRISTA, INC., A DE CORPORATION, F/K/A BOTRISTA TECHNOLOGY, INC.
To: EAST WEST BANK, A CALIFORNIA BANKING CORPORATION
Reel/Frame 070228/0600 →
CHANGE OF NAME Recorded Apr 11, 2024
From: BOTRISTA TECHNOLOGY, INC.
To: BOTRISTA, INC.
Reel/Frame 067070/0485 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2022
From: KUO, WU-CHOU; LEE, YU-MIN
To: BOTRISTA TECHNOLOGY, INC.
Reel/Frame 059045/0518 →