IP Library › Granted Patent US 1,055,006
Granted Patent S1
US 1,055,006 · App. 29/831,297 · Granted Dec 24, 2024

Support ring for an interlocking process kit for a substrate processing chamber

Inventors: Sahiti Nallagonda (San Jose, CA); Jonathan Simmons (San Jose, CA); Xinwei Huang (San Jose, CA); Peter Muraoka (San Mateo, CA); Andreas Schmid (Sunnyvale, CA)
Assignee: Applied Materials, Inc.
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Quick Facts
Patent No.
US 1,055,006
App. No.
29/831,297
Granted
Dec 24, 2024
Kind
S1
Claims (1)

The ornamental design for a support ring for an interlocking process kit for a substrate processing chamber, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2022
From: NALLAGONDA, SAHITI; SIMMONS, JONATHAN; HUANG, XINWEI; MURAOKA, PETER; SCHMID, ANDREAS
To: APPLIED MATERIALS, INC.
Reel/Frame 059597/0392 →