IP Library Granted Patent US 1,068,869
Granted Patent S1
US 1,068,869 · App. 29/922,552 · Granted Apr 1, 2025

Mold

Inventors: Danwei Ye (Solon, OH); Andrianna Niebling (Tempe, AZ)
Assignee: Hologram Holdings I, Inc.
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Quick Facts
Patent No.
US 1,068,869
App. No.
29/922,552
Granted
Apr 1, 2025
Kind
S1
Claims (1)

The ornamental design for a mold, as shown and described.

Assignments (4)
INTELLECTUAL PROPERTY ASSIGNMENT OF SECURITY INTEREST Recorded Dec 23, 2025
From: ABL OPCO LLC
To: BLACK FEATHER FUNDING, LLC
Reel/Frame 074034/0965 →
SECURITY INTEREST Recorded May 8, 2025
From: HOLOGRAM HOLDINGS I, INC.; DAYGLOW LLC
To: ABL OPCO LLC
Reel/Frame 071233/0675 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2024
From: SPECTRUM DIVERSIFIED DESIGNS, LLC
To: HOLOGRAM HOLDINGS I, INC.
Reel/Frame 069715/0780 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2024
From: YE, DANWEI; NIEBLING, ANDRIANNA
To: SPECTRUM DIVERSIFIED DESIGNS, LLC
Reel/Frame 066005/0448 →