Granted Patent
S1
US 962,883 · App. 35/512,766 · Granted Sep 6, 2022
Temporary protective film for manufacturing semiconductor devices
Assignee:
SHOWA DENKO MATERIALS CO., LTD.
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Claims (1)
The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.
Assignments (2)
CHANGE OF ADDRESS
Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Jan 7, 2022
From: TOMORI, NAOKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058666/0590 →