IP Library › Granted Patent US 1,042,376
Granted Patent S1
US 1,042,376 · App. 35/518,119 · Granted Sep 17, 2024

Semiconductor module

Inventors: Koshun Saito (Kyoto, JP); Koki Nakano (Kyoto, JP)
Assignee: ROHM CO., LTD.
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Quick Facts
Patent No.
US 1,042,376
App. No.
35/518,119
Granted
Sep 17, 2024
Kind
S1
Claims (1)

The ornamental design for a semiconductor module, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2023
From: SAITO, KOSHUN; NAKANO, KOKI
To: ROHM CO., LTD.
Reel/Frame 065636/0110 →
Priority Claims (1)
JP 2022-003659 D · Feb 25, 2022 · national