IP Library › Patent Application 60262238
Patent Application Provisional
App. No. 60/262,238 · Confirmation No. 5203

Reliability improvement of area array solder joints changing attachment pad geometry

Provisional Application Expired
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 Code Description Pages PDF
2001-01-16 TRNA Transmittal of New Application 2 View
2001-01-16 SPEC Specification 336 View
2001-01-16 ABST Abstract 1 View
2001-01-16 DRW Drawings-only black and white line drawings 14 View
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Quick Facts
App. No.
60/262,238
Filed
2001-01-16