Plastic semiconductor package structure and method of making it

Inventors: Sang D. Lee, Flynn Carson, Ki T. Ryu, Koo H. Lee

Provisional Application Expired

	Code	Description	Pages	PDF
2001-02-27	`TRNA`	Transmittal of New Application	1	View
2001-02-27	`SPEC`	Specification	3	View
2001-02-27	`DRW`	Drawings-only black and white line drawings	10	View

Inventors

Sang D. Lee Gilbert, AZ

Flynn Carson Redwood City, CA

Ki T. Ryu Inchon-City, KOREA, REPUBLIC OF

Koo H. Lee Seoul, KOREA, REPUBLIC OF

Attorneys & Agents of Record

KORBIN VAN DYKE Reg. 52313 Agent

ANDREW DUNLAP Reg. 60554 Attorney · WENDEROTH, LIND & PONACK, L.L.P.

HANNAH POWELL Reg. 84418 Agent · HAYNES BEFFEL & WOLFELD LLP

MARK HAYNES Reg. 30846 Attorney · HAYNES BEFFEL & WOLFELD LLP

FRANKLIN SCHELLENBERG Reg. 47315 Agent

WARREN WOLFELD Reg. 31454 Attorney · HAYNES BEFFEL & WOLFELD LLP

ERNEST BEFFEL Reg. 43489 Attorney · HAYNES BEFFEL & WOLFELD, LLP

JASON LIAO Reg. 59382 Agent

PAUL DURDIK Reg. 37819 Attorney · HAYNES BEFFEL AND WOLFELD LLP

Prosecution

No recorded assignments were found for this patent.

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