Patent Application
Provisional
App. No. 60/272,280
· Confirmation No. 7561
Apparatus and process for precise encapsulation of flip chip interconnects
Inventor:
Rajendra D. Pendse
Provisional Application Expired
Inventors
Rajendra D. Pendse
Fremont, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- 60084/301100
- Confirmation No.
- 7561
Child
Claims priority from a provisional application
→
App. 10/456,434
Filed 2003-06-06
· Abandoned -- Failure to Respond to an Office Action
Child
Claims priority from a provisional application
→
App. 10/081,425
· US 6,780,682
Filed 2002-02-22
· Patented Case
Child
Claims priority from a provisional application
→
App. 12/018,441
Filed 2008-01-23
· Abandoned -- After Examiner's Answer or Board of Appeals Decision
Child
PCT
Claims priority from a provisional application
→
PCT/US2002/005634
Filed 2002-02-25
· PCT - IPER (International Preliminary Examination Report) 409-416 Mailed
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/272,280
- Filed
- 2001-02-27
External Links