IP Library › Patent Application 60302578
Patent Application Provisional
App. No. 60/302,578 · Confirmation No. 7706

Optical chip packaging via through hole

Inventor: Richard Stack
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2001-06-29 TRNA Transmittal of New Application 2 View
2001-06-29 SPEC Specification 9 View
2001-06-29 DRW Drawings-only black and white line drawings 5 View
2001-06-29 LET. Miscellaneous Incoming Letter 83 View
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Quick Facts
App. No.
60/302,578
Filed
2001-06-29