IP Library Patent Application 60315009
Patent Application Provisional
App. No. 60/315,009 · Confirmation No. 2856

Through-wafer heat sink for semiconductor devices

Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2001-08-24 TRNA Transmittal of New Application 2 View
2001-08-24 SPEC Specification 6 View
2001-08-24 CLM Claims 2 View
2001-08-24 ABST Abstract 1 View
2001-08-24 DRW Drawings-only black and white line drawings 3 View
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Quick Facts
App. No.
60/315,009
Filed
2001-08-24