IP Library › Patent Application 60327609
Patent Application Provisional
App. No. 60/327,609 · Confirmation No. 3863

Power semiconductor module having three dimensional structure

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2001-10-05 TRNA Transmittal of New Application 3 View
2001-10-05 SPEC Specification 19 View
2001-10-05 CLM Claims 2 View
2001-10-05 ABST Abstract 1 View
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Quick Facts
App. No.
60/327,609
Filed
2001-10-05