IP Library › Patent Application 60338107
Patent Application Provisional
App. No. 60/338,107 · Confirmation No. 2377

Slurry composition for chemical mechanical planarization (CMP) of low dielectric constant (Low-K) inter-layer dielectric (ILD) and inter-metal dielectric (IMD) materials and for silicon dioxide (SiO2) and silicon carbide (SiC) hard mask capping layers

Provisional Application Expired
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 Code Description Pages PDF
2001-12-06 TRNA Transmittal of New Application 1 View
2001-12-06 SPEC Specification 3 View
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Quick Facts
App. No.
60/338,107
Filed
2001-12-06