IP Library › Patent Application 60338300
Patent Application Provisional
App. No. 60/338,300 · Confirmation No. 3959

Process for the removal of copper from polished boron-doped silicon wafers

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2001-11-13 TRNA Transmittal of New Application 3 View
2001-11-13 ADS Application Data Sheet 3 View
2001-11-13 SPEC Specification 16 View
2001-11-13 CLM Claims 7 View
2001-11-13 ABST Abstract 1 View
2001-11-13 DRW Drawings-only black and white line drawings 4 View
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Quick Facts
App. No.
60/338,300
Filed
2001-11-13