Patent Application
Provisional
App. No. 60/339,734
· Confirmation No. 1433
Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures
Provisional Application Expired
Inventors
Ann R. H. Fornof
Toledo, OH
Jeffrey C. Hedrick
Montvale, NJ
Kang-Wook Lee
Yorktown Heights, NY
Kelly Malone
Poughkeepsie, NY
Christy S. Tyberg
Croton-on Hudson, NY
Attorneys & Agents of Record
Prosecution
- Docket No.
- YOR920010776US1
- Confirmation No.
- 1433
Child
Claims priority from a provisional application
→
App. 10/290,682
· US 6,783,862
Filed 2002-11-08
· Patented Case
Child
Claims priority from a provisional application
→
App. 10/290,616
· US 6,933,586
Filed 2002-11-08
· Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Child
Claims priority from a provisional application
→
App. 96/000,046
· Termination of SE Request (No Filing Date)
Child
Claims priority from a provisional application
→
App. 10/601,387
· US 6,844,257
Filed 2003-06-23
· Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Child
PCT
Claims priority from a provisional application
→
PCT/US2002/040020
Filed 2002-12-13
· PCT - IPER (International Preliminary Examination Report) 409-416 Mailed
No recorded assignments were found for this patent.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/339,734
- Filed
- 2001-12-13
External Links