Patent Application
Provisional
App. No. 60/401,017
· Confirmation No. 8382
Method for ultra-high density mass-interconnection of temperature sensitive electronic devices
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2016-02-17 | C.AD |
Change of Address | 2 | View | |
| 2016-02-17 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2002-08-02 | TRNA |
Transmittal of New Application | 3 | View | |
| 2002-08-02 | SPEC |
Specification | 13 | View | |
| 2002-08-02 | CLM |
Claims | 4 | View | |
| 2002-08-02 | ABST |
Abstract | 1 | View | |
| 2002-08-02 | DRW |
Drawings-only black and white line drawings | 12 | View |
Inventors
Kenneth R. Erikson
Henniker, NH
John Marciniec
Framingham, MA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 24222
- Docket No.
- 20020011PROV
- Confirmation No.
- 8382
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/401,017
- Filed
- 2002-08-02
External Links