IP Library › Patent Application 60404443
Patent Application Provisional
App. No. 60/404,443 · Confirmation No. 9008

Multi-layer package for multiple semiconductor chip integrated with distributed passive RF structures

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2002-08-19 TRNA Transmittal of New Application 4 View
2002-08-19 SPEC Specification 3 View
2002-08-19 LET. Miscellaneous Incoming Letter 3 View
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Quick Facts
App. No.
60/404,443
Filed
2002-08-19