IP Library › Patent Application 60410895
Patent Application Provisional Small
App. No. 60/410,895 · Confirmation No. 4736

Vertically integrated microelectronic module utilizing ultra-thin IC layers with dense area-interconnects and method for making the same

Provisional Application Expired
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 Code Description Pages PDF
2002-09-16 TRNA Transmittal of New Application 3 View
2002-09-16 SPEC Specification 2 View
2002-09-16 CLM Claims 1 View
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Quick Facts
App. No.
60/410,895
Filed
2002-09-16