IP Library › Patent Application 60484047
Patent Application Provisional
App. No. 60/484,047 · Confirmation No. 8517

Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps

Inventor: Rajendra J. Pendse
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2003-07-01 WFEE Fee Worksheet (SB06) 1 View
2003-07-01 TRNA Transmittal of New Application 1 View
2003-07-01 ADS Application Data Sheet 3 View
2003-07-01 SPEC Specification 7 View
2003-07-01 CLM Claims 1 View
2003-07-01 ABST Abstract 1 View
2003-07-01 DRW Drawings-only black and white line drawings 1 View
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Quick Facts
App. No.
60/484,047
Filed
2003-07-01