IP Library › Patent Application 60531233
Patent Application Provisional
App. No. 60/531,233 · Confirmation No. 3641

Lead free solder friendly thermoplastic blends

Inventor: Bo Liu
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2003-12-19 TRNA Transmittal of New Application 2 View
2003-12-19 SPEC Specification 12 View
2003-12-19 CLM Claims 1 View
2003-12-19 ABST Abstract 1 View
2003-12-19 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/531,233
Filed
2003-12-19