Patent Application
Provisional
App. No. 60/558,813
· Confirmation No. 1074
Wire bond capillary tip
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2004-04-02 | TRNA |
Transmittal of New Application | 2 | View | |
| 2004-04-02 | SPEC |
Specification | 6 | View | |
| 2004-04-02 | CLM |
Claims | 1 | View | |
| 2004-04-02 | ABST |
Abstract | 1 | View | |
| 2004-04-02 | DRW |
Drawings-only black and white line drawings | 4 | View | |
| 2004-04-02 | ADS |
Application Data Sheet | 4 | View | |
| 2004-04-02 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
Kenny Lee
Seoul, KOREA, REPUBLIC OF
Hun-Teak Lee
Ichon-si, KOREA, REPUBLIC OF
Jong Kook Kim
Suwon-si, KOREA, REPUBLIC OF
ChulSik Kim
Ichon-si, KOREA, REPUBLIC OF
Ki-Youn Jang
Incheon, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- CPAC 1088-1
- Confirmation No.
- 1074
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2004-12-09
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Quick Facts
- App. No.
- 60/558,813
- Filed
- 2004-04-02
External Links