Patent Application
Provisional
App. No. 60/577,213
· Confirmation No. 2392
Thermally improved placement of electronic components
Inventor:
Rudi Verbist
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2004-06-07 | TRNA |
Transmittal of New Application | 5 | View | |
| 2004-06-07 | SPEC |
Specification | 19 | View | |
| 2004-06-07 | CLM |
Claims | 3 | View | |
| 2004-06-07 | ABST |
Abstract | 1 | View | |
| 2004-06-07 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2004-06-07 | ADS |
Application Data Sheet | 2 | View | |
| 2004-06-07 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
Rudi Verbist
Mechelen, BELGIUM
Attorneys & Agents of Record
Prosecution
- Customer No.
- 26111
- Docket No.
- 1875.6300000
- Confirmation No.
- 2392
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/577,213
- Filed
- 2004-06-07
External Links