Patent Application
Provisional
App. No. 60/587,428
· Confirmation No. 6675
Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2004-07-13 | TRNA |
Transmittal of New Application | 2 | View | |
| 2004-07-13 | SPEC |
Specification | 11 | View | |
| 2004-07-13 | CLM |
Claims | 1 | View | |
| 2004-07-13 | ABST |
Abstract | 1 | View | |
| 2004-07-13 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2004-07-13 | ADS |
Application Data Sheet | 4 | View | |
| 2004-07-13 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
Marcos Karnezos
Palo Alto, CA
Flynn Carson
Redwood City, CA
Youngcheol Kim
Young in-si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- CPAC 1094-1
- Confirmation No.
- 6675
Child
PCT
Claims priority from a provisional application
→
PCT/US2005/024538
Filed 2005-07-11
· RO PROCESSING COMPLETED-PLACED IN STORAGE
Child
Claims priority from a provisional application
→
App. 11/022,375
· US 7,253,511
Filed 2004-12-23
· Patented Case
Child
Claims priority from a provisional application
→
App. 11/772,776
· US 7,692,279
Filed 2007-07-02
· Patented Case
Child
Claims priority from a provisional application
→
App. 12/699,787
· US 7,829,382
Filed 2010-02-03
· Patented Case
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE THIRD INVENTOR TO YOUNGCHEOL KIM, PREVIOUSLY RECORDED ON REEL 015798 FRAME 0061.
Recorded 2005-07-18
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2005-03-19
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Quick Facts
- App. No.
- 60/587,428
- Filed
- 2004-07-13
External Links