Patent Application
Provisional
App. No. 60/616,499
· Confirmation No. 5308
Method for reflowing a metal plating layer of a contact and contact formed thereby
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2004-12-02 | EBCC.AD |
Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update | 1 | View | |
| 2004-10-06 | TRNA |
Transmittal of New Application | 3 | View | |
| 2004-10-06 | SPEC |
Specification | 17 | View | |
| 2004-10-06 | CLM |
Claims | 7 | View | |
| 2004-10-06 | ABST |
Abstract | 1 | View | |
| 2004-10-06 | DRW |
Drawings-only black and white line drawings | 1 | View | |
| 2004-10-06 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2004-10-06 | ADS |
Application Data Sheet | 3 | View |
Inventors
Attorneys & Agents of Record
Prosecution
- Customer No.
- 7278
- Docket No.
- 06026/0201951-US0
- Confirmation No.
- 5308
No recorded assignments were found for this patent.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/616,499
- Filed
- 2004-10-06
External Links