Patent Application
Provisional
App. No. 60/620,750
· Confirmation No. 4785
Method for reducing semiconductor die warpage
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2004-10-21 | TRNA |
Transmittal of New Application | 2 | View | |
| 2004-10-21 | SPEC |
Specification | 5 | View | |
| 2004-10-21 | CLM |
Claims | 3 | View | |
| 2004-10-21 | ABST |
Abstract | 1 | View | |
| 2004-10-21 | DRW |
Drawings-only black and white line drawings | 2 | View | |
| 2004-10-21 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2004-10-21 | ADS |
Application Data Sheet | 3 | View |
Inventors
Seung Wook Park
Seoul, KOREA, REPUBLIC OF
Tae Woo Lee
Jun dong, KOREA, REPUBLIC OF
Hyun Jin Park
Sunngnam -si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22470
- Docket No.
- CPAC 1099-1
- Confirmation No.
- 4785
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2005-12-06
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/620,750
- Filed
- 2004-10-21
External Links