IP Library › Patent Application 60654554
Patent Application Provisional
App. No. 60/654,554 · Confirmation No. 2531

Methods and systems for controlling mold temperatures

Provisional Application Expired
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 Code Description Pages PDF
2005-12-09 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2005-02-18 TRNA Transmittal of New Application 3 View
2005-02-18 SPEC Specification 77 View
2005-02-18 CLM Claims 5 View
2005-02-18 ABST Abstract 1 View
2005-02-18 DRW Drawings-only black and white line drawings 23 View
2005-02-18 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/654,554
Filed
2005-02-18