IP Library › Patent Application 60659294
Patent Application Provisional
App. No. 60/659,294 · Confirmation No. 8259

Curable composition having low coefficient of thermal expansion, method of making an integrated circuit, and an integrated circuit made there from

Provisional Application Expired
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 Code Description Pages PDF
2005-03-07 TRNA Transmittal of New Application 3 View
2005-03-07 SPEC Specification 23 View
2005-03-07 CLM Claims 5 View
2005-03-07 ABST Abstract 1 View
2005-03-07 DRW Drawings-only black and white line drawings 3 View
2005-03-07 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/659,294
Filed
2005-03-07