IP Library › Patent Application 60682144
Patent Application Provisional
App. No. 60/682,144 · Confirmation No. 5153

Thermoplastic molding material for electronic packaging

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2005-05-18 TRNA Transmittal of New Application 1 View
2005-05-18 SPEC Specification 11 View
2005-05-18 CLM Claims 2 View
2005-05-18 ABST Abstract 1 View
2005-05-18 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/682,144
Filed
2005-05-18