IP Library › Patent Application 60693033
Patent Application Provisional
App. No. 60/693,033 · Confirmation No. 2156

Module having stacked chip scale semiconductor packages

Inventor: Marcos Karnezos
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2005-06-20 TRNA Transmittal of New Application 1 View
2005-06-20 SPEC Specification 12 View
2005-06-20 CLM Claims 1 View
2005-06-20 ABST Abstract 1 View
2005-06-20 DRW Drawings-only black and white line drawings 4 View
2005-06-20 WFEE Fee Worksheet (SB06) 1 View
2005-06-20 ADS Application Data Sheet 3 View
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Quick Facts
App. No.
60/693,033
Filed
2005-06-20