Patent Application
Provisional
Small
App. No. 60/711,375
· Confirmation No. 7255
High density interconnect scheme for stacked electronic modules
Inventor:
John Kennedy
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2024-04-28 | M327 |
Miscellaneous Communication to Applicant - No Action Count | 1 | View | |
| 2024-04-28 | M327 |
Miscellaneous Communication to Applicant - No Action Count | 1 | View | |
| 2005-08-26 | TRNA |
Transmittal of New Application | 1 | View | |
| 2005-08-26 | SPEC |
Specification | 11 | View | |
| 2005-08-26 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
John Kennedy
Irvine, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 39601
- Docket No.
- Fuzz Button
- Confirmation No.
- 7255
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2024-03-26
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Quick Facts
- App. No.
- 60/711,375
- Filed
- 2005-08-26
External Links