IP Library › Patent Application 60748890
Patent Application Provisional
App. No. 60/748,890 · Confirmation No. 5836

Redistribution of small die pads using a silicon substrate

Inventor: Andrew N. Sawle
Provisional Application Expired
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 Code Description Pages PDF
2005-12-09 TRNA Transmittal of New Application 2 View
2005-12-09 SPEC Specification 4 View
2005-12-09 CLM Claims 1 View
2005-12-09 DRW Drawings-only black and white line drawings 8 View
2005-12-09 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/748,890
Filed
2005-12-09