IP Library Patent Application 60761171
Patent Application Provisional
App. No. 60/761,171 · Confirmation No. 3829

Wafer level chip packaging

Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2006-08-03 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2006-02-21 CFILE Request for Corrected Filing Receipt 13 View
2006-01-23 TRNA Transmittal of New Application 4 View
2006-01-23 SPEC Specification 39 View
2006-01-23 CLM Claims 14 View
2006-01-23 DRW Drawings-only black and white line drawings 47 View
2006-01-23 WFEE Fee Worksheet (SB06) 1 View
2006-01-23 ADS Application Data Sheet 6 View
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Quick Facts
App. No.
60/761,171
Filed
2006-01-23