IP Library › Patent Application 60775086
Patent Application Provisional
App. No. 60/775,086 · Confirmation No. 6273

Wafer level chip packaging

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2006-02-21 TRNA Transmittal of New Application 3 View
2006-02-21 SPEC Specification 58 View
2006-02-21 DRW Drawings-only black and white line drawings 54 View
2006-02-21 WFEE Fee Worksheet (SB06) 1 View
2006-02-21 ADS Application Data Sheet 6 View
2006-02-21 APPENDIX Appendix to the specification 69 View
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Quick Facts
App. No.
60/775,086
Filed
2006-02-21