IP Library › Patent Application 60870331
Patent Application Provisional
App. No. 60/870,331 · Confirmation No. 4937

MOLDED COMMUNICATIONS MODULE HAVING INTEGRATED PLASTIC CIRCUIT STRUCTURES

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2007-01-23 APP.FILE.REC Filing Receipt 3 View
2006-12-15 SPEC Specification 13 View
2006-12-15 CLM Claims 1 View
2006-12-15 DRW Drawings-only black and white line drawings 5 View
2006-12-15 ADS Application Data Sheet 5 View
2006-12-15 WFEE Fee Worksheet (SB06) 2 View
2006-12-15 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
60/870,331
Filed
2006-12-15