IP Library › Patent Application 60877630
Patent Application Provisional
App. No. 60/877,630 · Confirmation No. 2667

Hot melt thermosetting polyimide adhesives containing diacetylene groups

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2007-01-24 APP.FILE.REC Filing Receipt 3 View
2006-12-29 TRNA Transmittal of New Application 1 View
2006-12-29 SPEC Specification 7 View
2006-12-29 DRW Drawings-only black and white line drawings 4 View
2006-12-29 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/877,630
Filed
2006-12-29