Patent Application
Provisional
App. No. 60/914,105
· Confirmation No. 1124
Polysilicon Planarization Solution for Planarizing Low Temperature Poly-Silicon Thin Film Panels
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-06-14 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2007-06-14 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2007-05-08 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-04-26 | TRNA |
Transmittal of New Application | 2 | View | |
| 2007-04-26 | SPEC |
Specification | 7 | View | |
| 2007-04-26 | CLM |
Claims | 4 | View | |
| 2007-04-26 | ABST |
Abstract | 1 | View | |
| 2007-04-26 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2007-04-26 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
Sang In Kim
Yongin City, KOREA, REPUBLIC OF
Seong Jin Hong
Chungcheoungbuk-do, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 24289
- Docket No.
- H-MB-00025.P1
- Confirmation No.
- 1124
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2007-05-30
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Quick Facts
- App. No.
- 60/914,105
- Filed
- 2007-04-26
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