IP Library Patent Application 60945415
Patent Application Provisional
App. No. 60/945,415 · Confirmation No. 9177

Process For Forming Continuous Copper Thin Films Via Vapor Deposition

Provisional Application Expired
⬇ PDF
Code Description Pages PDF
2008-06-19 PD.TO.AUTH Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office 1 View
2008-06-19 N417 Electronic Filing System Acknowledgment Receipt 2 View
2007-07-27 APP.FILE.REC Filing Receipt 3 View
2007-06-21 ADS Application Data Sheet 4 View
2007-06-21 SPEC Specification 18 View
2007-06-21 CLM Claims 3 View
2007-06-21 ABST Abstract 1 View
2007-06-21 DRW Drawings-only black and white line drawings 3 View
2007-06-21 PD.TO.AUTH Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office 1 View
2007-06-21 WFEE Fee Worksheet (SB06) 2 View
2007-06-21 N417 Electronic Filing System Acknowledgment Receipt 3 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
60/945,415
Filed
2007-06-21