IP Library Patent Application 60945748
Patent Application Provisional
App. No. 60/945,748 · Confirmation No. 1839

Process For Forming Continuous Copper Thin Films Via Vapor Deposition

Provisional Application Expired
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Code Description Pages PDF
2008-06-23 APP.FILE.REC Filing Receipt 3 View
2008-06-19 PD.TO.AUTH Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office 1 View
2008-06-19 N417 Electronic Filing System Acknowledgment Receipt 2 View
2007-07-06 APP.FILE.REC Filing Receipt 3 View
2007-06-22 ADS Application Data Sheet 4 View
2007-06-22 SPEC Specification 18 View
2007-06-22 CLM Claims 3 View
2007-06-22 ABST Abstract 1 View
2007-06-22 DRW Drawings-only black and white line drawings 3 View
2007-06-22 PD.TO.AUTH Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office 1 View
2007-06-22 WFEE Fee Worksheet (SB06) 2 View
2007-06-22 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
60/945,748
Filed
2007-06-22