Patent Application
Provisional
App. No. 60/968,920
· Confirmation No. 2133
Method and Composition For Chemical Mechanical Planarization of Copper
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-09-05 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-08-30 | PD.TO.AUTH |
Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office | 1 | View | |
| 2007-08-30 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2007-08-30 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2007-08-30 | ADS |
Application Data Sheet | 5 | View | |
| 2007-08-30 | SPEC |
Specification | 17 | View | |
| 2007-08-30 | CLM |
Claims | 2 | View | |
| 2007-08-30 | ABST |
Abstract | 1 | View |
Inventors
Bentley J. Palmer
Phoenix, AZ
Ann Marie Meyers
Chandler, AZ
Suresh Shrauti
Dallas, TX
Guangying Zhang
Phoenix, AZ
Ajoy Zutshi
Chandler, AZ
Attorneys & Agents of Record
Prosecution
- Customer No.
- 23543
- Docket No.
- 07141Z USA
- Confirmation No.
- 2133
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 60/968,920
- Filed
- 2007-08-30
External Links