Patent Application
Provisional
App. No. 60/977,469
· Confirmation No. 8716
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE HAVING RELIEVED ACTIVE REGION
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-10-19 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-10-04 | ADS |
Application Data Sheet | 5 | View | |
| 2007-10-04 | SPEC |
Specification | 7 | View | |
| 2007-10-04 | CLM |
Claims | 1 | View | |
| 2007-10-04 | ABST |
Abstract | 1 | View | |
| 2007-10-04 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2007-10-04 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2007-10-04 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Byung Tai Do
Singapore, SINGAPORE
Sang-Ho Lee
Kyounggi, KOREA, REPUBLIC OF
Jong Wook Ju
Bubal-eub Icheon-Si, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-466P
- Confirmation No.
- 8716
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2008-10-10
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/977,469
- Filed
- 2007-10-04
External Links