Patent Application
Provisional
App. No. 60/991,175
· Confirmation No. 1436
DIMETHYLFORMAMIDE-FREE FORMULATIONS USING DICYANDIAMIDE AS CURING AGENT FOR THERMOSETTING EPOXY RESINS
Inventor:
Joseph GAN
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2008-02-19 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2008-02-01 | CFILE |
Request for Corrected Filing Receipt | 7 | View | |
| 2008-01-04 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-11-29 | TRNA |
Transmittal of New Application | 2 | View | |
| 2007-11-29 | SPEC |
Specification | 27 | View | |
| 2007-11-29 | CLM |
Claims | 3 | View | |
| 2007-11-29 | ABST |
Abstract | 1 | View | |
| 2007-11-29 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2007-11-29 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
Joseph GAN
Strasbourg, FRANCE
Attorneys & Agents of Record
Prosecution
- Customer No.
- 64382
- Docket No.
- 02468/043001
- Confirmation No.
- 1436
from
GAN, JOSEPH
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2008-12-02
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2008-12-02
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2008-12-02
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Quick Facts
- App. No.
- 60/991,175
- Filed
- 2007-11-29
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