Patent Application
Provisional
App. No. 61/055,288
· Confirmation No. 4633
Method and Composition For Post-CMP Cleaning of Copper Interconnects Comprising Noble Metal Barrier Layers
Inventor:
Dnyanesh Chandrakant Tamboli
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2008-06-09 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2008-06-02 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2008-05-22 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2008-05-22 | SPEC |
Specification | 13 | View | |
| 2008-05-22 | CLM |
Claims | 1 | View | |
| 2008-05-22 | ABST |
Abstract | 1 | View | |
| 2008-05-22 | DRW |
Drawings-only black and white line drawings | 2 | View | |
| 2008-05-22 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2008-05-22 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
Dnyanesh Chandrakant Tamboli
Breinigsville, PA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 23543
- Docket No.
- 07209Z USA
- Confirmation No.
- 4633
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 61/055,288
- Filed
- 2008-05-22
External Links