Patent Application
Provisional
App. No. 61/079,900
· Confirmation No. 3119
PACKAGE STRUCUTRE OF AN INTEGRATED CIRCUIT CHIP STACK AND METHOD THEREOF
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2009-01-16 | LET. |
Miscellaneous Incoming Letter | 1 | View | |
| 2009-01-16 | ARTIFACT |
Artifact sheet indicating an item has been filed which cannot be scanned | 1 | View | |
| 2008-08-06 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2008-07-11 | TR.PROV |
Provisional Cover Sheet (SB16) | 3 | View | |
| 2008-07-11 | SPEC |
Specification | 11 | View | |
| 2008-07-11 | ABST |
Abstract | 1 | View | |
| 2008-07-11 | DRW |
Drawings-only black and white line drawings | 9 | View | |
| 2008-07-11 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2008-07-11 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View |
Inventors
David Wei WANG
Hsinchu, TAIWAN
An-Hong Liu
Hsinchu, TAIWAN
Hao-Yin Tsai
Hsinchu, TAIWAN
Hsiang-Ming Huang
Hsinchu, TAIWAN
Yi-Chang Lee
Hsinchu, TAIWAN
Shu-Ching Ho
Hsinchu, TAIWAN
Attorneys & Agents of Record
Prosecution
- Customer No.
- 60601
- Docket No.
- 5528/0122PR01
- Confirmation No.
- 3119
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 61/079,900
- Filed
- 2008-07-11
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